Principle and Procedure:
The JEOL Cross Section Polisher (CP) consists of:
Features of CP:
Specification of CP:
Gold Wire Bond
Figure(A) shows the backscattered electron image of a cross section of gold wire bonding on a silicon integrated circuit prepared with the CP. In spite of the large differences in hardness between all the materials, including silicon, aluminum, and gold, the cross section is very high quality. The results reveal failure at the bonding layers as narrow cracks and small voids are clearly observed in figure (B).
Figure (A) shows an overview of a specimen of galvanized coating on steel prepared using the CP. The processing conditions typically affect the adhesion properties of such a coating. Therefore it is crucial to preserve the integrity of the interface layer. The CP preparation provides a unique insight into coating technology while preserving the structural integrity of the metal interface. Figure (B) shows the Zn-Al-Si eutectic in the coating.
Thin Film Analysis
Cross-sectional observation is critical for thin film manufacturing for determination of adhesion properties of thin film; however, typical mechanical sample preparation often smears the interface layers and makes such observations somewhat ambiguous. In Figures (A) and (B) present a backscattered image and corresponding EBSD pattern from a metal thin film on glass. The images clearly show differences in the layer structure of the film. The CP preparation facilitates easy and straightforward EBSD pattern acquisition due to minimal surface strain and distortion.
Fiber optic cable specimens are difficult to prepare via traditional methods due to differences in hardness between the layers of thermoplastic polymer cladding and the thin polymer/glass multilayers comprising the overall structure. As presented in the figure, the Cross Section Polisher allows easy sample preparation, and SEM observation and measurement of layer uniformity and thickness.